Addressing the needs of high-brightness LEDs, Invensas’ novel wafer-level LED packaging structure is integrated into the device stack to deliver superior thermal and optical performance. Using a full wafer-level batch process, from device fabrication to packaging for light extraction and wavelength conversion, enables high throughput and high yield in LED manufacturing at low cost, and is scalable to large wafer sizes. This process allows Invensas to achieve the maximal thermal dissipation rate from active device stack to substrate, while offering high aperture ratio and optimal light output.
Post time: Jun-30-2017